CPU World報導,英特爾次世代微架構Broadwell將主打行動運算裝置市場,提供更好的CPU和GPU表現,並能大幅節省電力。最先採用新架構的行動處理器,有H、U、Y三種類,預計明年下半上市。其中Y種類的超低功耗系統晶片,熱度範圍(thermal envelope)僅有4.5瓦,適用於平板和2合1變形筆電,正是英特爾近來極力開發的市場。
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